Thats the one ![]()
Yes, best practice is to reball anything in which you can’t see the balls from above IE: any BGA IC, and worst case general rule of thumb is reball anything which has > x4 balls otherwise you risk the chip slanting/skewing and shorting higher voltage lines to lower and destroying things elsewhere.
You can reball the IC from a donor with stencils and solder paste - just ensure that the resulting balls are all an even height to one another. Or you may be able to find this chip new preballed or used preballed ![]()
Just be shure to shield the speaker connector during reflow