They do unfortunately, they tie it to the EMMC
While i would agree with you that reflow is not the best resolution long term depending, i think in certain circumstances a reball can be faultless until the consoles natural death many years from now under certain circumstances.
Reason: I’ve noticed that these consoles - being a handheld, are subject to incredible board warp, this can be as a result of flex issues and/or poor prior repair attempts (USB in particular) this can cause opens under the SoC, typically once the SoC is removed (and if applicable all other issues relating to prior repair attempts are resolved - USB etc) then the board will return to it’s normal “flat” state after heat, and the leaded solder adds more ductility in future.
In some cases, the board warp is so severe it pulls the pads and sometimes traces below the SoC, in this case the board cannot be used… or you have to painstakingly repair the pads and traces.
So provided the critical rails on the SoC measure fine, and provided the board is in good condition and not beyond a certain point, a reflow, but prefereably a reball is fine. Though, if you were doing this repair for a customer, you would inform them of this and guarantee the repair or charge them less and make it clear it could fail down the line.