Solder would not magically bubble out the sides during reflow 
it happened becaused you overloaded the pads (specifically the central GND pad) and squeezed it down during reflow (bad, bad practice)
check the topic here where I detail why you shouldn’t be squeezing down IC’s
I’ve been seeing a fair number of boards recently which have had rework at the P13, M92, BQ areas by people who utilize this dumb squeeze down technique (evident by tweezer dints in chips and notable board warp in some cases) and in a lot of these cases I also find internal board VIA damage which goes hand in hand with it - these make the boards ultimately unreapairable
I think the biggest issue is you messing with IC’s which aren’t related to your problem, and in this case it’s hard to know if your just creating more problems 
hopefully once you’ve replaced the M92 we will see a change but tbh I think you should give your customer 20 quid and use this board as a donor and just buy a replacement board for him